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Aviation Aluminum Alloy Leading Wheel Material Multi Wire Saw Machine 20kW Power Consumption 5000x3000x2000mm Engineered for Cutting Performance

Détails du produit:

Place of Origin:	China
Nom de marque:	OEM

Informations détaillées

Place of Origin:

China

Nom de marque:

OEM

Garantie:

Un an

Puissance totale:

300 kW

Méthode de coupe:

Saignées à plusieurs fils

Circuit de refroidissement:

Refroidissement de l'eau

Matériau de roue de guidage:

alliage d'aluminium de l'aviation

Système életrique:

Siemens

Modèle:

MW-1000

Dimensions:

5000 * 3000 * 2000 mm

Mettre en évidence:

High Light

Mettre en évidence:

aviation aluminum alloy multi wire saw machine

20kW power multi wire saw machine

5000x3000x2000mm multi wire saw machine

Informations sur le commerce

Minimum Order Quantity:

Payment Terms:

Description du produit

Multiple Wire Saw Machine for Precision Silicon Wafer Cutting

The Multiple Wire Saw Machine is an advanced wire cutting system engineered for high-precision silicon wafer processing in semiconductor manufacturing. This industrial-grade equipment delivers exceptional cutting performance with minimal material waste, optimizing production efficiency.

Key Features

High-Power Configuration: 300kW total power with 60kW main power unit
Energy Efficient: Optimized 20kW power consumption reduces operational costs
Versatile Cutting Capacity: Processes silicon wafers from 5mm to 30mm thickness
Multiple Wire Technology: Enables simultaneous wafer cutting for increased throughput
Precision Engineering: Aviation aluminum alloy leading wheel ensures cutting accuracy
Robust Construction: 5000×3000×2000mm dimensions provide stable operation

Technical Specifications

Parameter	Specification
Model	MW-1000
Cutting Method	Multi-wire Sawing
Power Consumption	20kW
Dimensions	5000×3000×2000mm
Leading Wheel Material	Aviation Aluminum Alloy
Cooling System	Water Cooling
Main Power	60kW
Total Power	300kW

Industrial Applications

This versatile wire cutting machine serves multiple industries with precision cutting solutions:

Semiconductor Manufacturing: Precision silicon wafer cutting for microelectronics
Stone Processing: Cutting granite, marble, and natural stone blocks
Advanced Materials: Processing ceramics, glass, and composite materials

Customization Options

We offer tailored configurations to meet specific production requirements:

Minimum order quantity: 1 unit
Siemens electric system for stable operation
Custom power configurations available
Flexible payment terms (TT)

Support & Services

Comprehensive technical support and troubleshooting
Scheduled maintenance programs
Genuine spare parts supply
Operator training and consultation
Software updates and upgrades

Packaging & Shipping

Each machine is securely packaged in reinforced wooden crates with protective materials. We offer multiple shipping options including sea, air, and land freight with full shipment tracking.

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High Light

Mettre en évidence:

aviation aluminum alloy multi wire saw machine

20kW power multi wire saw machine

5000x3000x2000mm multi wire saw machine

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Machine à découper des fils multiples,

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